Paper
3 July 1995 Sizing the next generation of optical photomasks
Gilbert V. Shelden, Anne Rudack, Rajeev R. Singh, Wayne Smith, Alvina M. Williams
Author Affiliations +
Abstract
Photomask technology remains one of the key enablers for the advancement of the semiconductor industry. Optical lithography will continue to be the mainstream technology for 0.25 micrometers and will likely extend below 0.2 micrometers . Continuous improvements in all aspects of fabrication will be required to support the ever decreasing error budgets as critical images continue to shrink. Additionally, stepper manufacturers will be migrating to large print fields via the use of advanced techniques like step and scan. The size of these print fields becomes limited, not by the size of the lens, but by the size of the photomask. For the photomask industry to cost-effectively implement the next reticle size, standardization will be required. Sufficient volume of production and higher process will be necessary to recover the high implementation costs.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gilbert V. Shelden, Anne Rudack, Rajeev R. Singh, Wayne Smith, and Alvina M. Williams "Sizing the next generation of optical photomasks", Proc. SPIE 2512, Photomask and X-Ray Mask Technology II, (3 July 1995); https://doi.org/10.1117/12.212801
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KEYWORDS
Reticles

Photomasks

Manufacturing

Semiconductors

Semiconducting wafers

Semiconductor manufacturing

Optical lithography

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