15 September 1995 Free-space optical interconnects and parallel accessed optical storage
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Abstract
Over the last decade, free-space optical interconnects have been investigated for their potential use for inter- and intra-chip communication. Among the unique characteristics of free-space interconnects are their 3D nature, lower power requirements and potential for higher connectivity and compactness. On the other hand, 3D assembly which can are emerging to package many electronic chips in a single 3D assembly which can provide single chip like performance. These 3D packaging techniques are especially useful when applications of interest require simultaneously algorithms with functions that do not fit in a few chips and a systems implementation with a small volume and weight. At UCSD, jointly with Hughes Research, we are investigating the potential impact of using free-space optical interconnects to communicate between several such 3D electronic modules. This approach relies on implementing long module to module communication by free-space optical interconnects conserving the benefits of 3D packaging of chips at the system level. This is derived by the good match that exists in the characteristics and capabilities of these electronic and optical 3D techniques in terms of I/O density, bandwidth, and small volume and power.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sadik C. Esener, "Free-space optical interconnects and parallel accessed optical storage", Proc. SPIE 2524, National Science Foundation (NSF) Forum on Optical Science and Engineering, (15 September 1995); doi: 10.1117/12.219575; http://dx.doi.org/10.1117/12.219575
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KEYWORDS
Optical interconnects

3D image processing

Optical storage

Free space optical communications

Data storage

Packaging

Telecommunications

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