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1 September 1995 Application of optical scattering in multichip module processing
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The impact of surface characterization on various aspects of microelectronic device performance and manufacture is briefly reviewed. Optical scattering measurements have been carried out for the surface characterization of AlN, MgO, Al2O3 substrates, single crystal silicon wafers and physcial vapor deposited films. Scattering light was recorded up to 80 degree from the specular direction. The angle-resolved scattered light sensitively reveals the characteristics of surface in the spatial frequency domain. Quantitative parameters of surface roughness have been derived from power spectral density distributions and diffraction theory for highly polished smooth surfaces. Instrumentation for full surface characterization has been coupled with computer operation. It has the features of high-speed and noncontact and is inherently area averaging. It lends itself particularly well to online product of high- speed and inprocess monitoring of a manufacturing process. Delicate surfaces can be rapidly 'finger printed'.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Meirong Tu, Yang Xu, Peter J. Gielisse, and Igor F. Kulisic "Application of optical scattering in multichip module processing", Proc. SPIE 2541, Optical Scattering in the Optics, Semiconductor, and Computer Disk Industries, (1 September 1995);

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