2 August 1995 Observation and analysis of grinding scratch generation around the central part of a component
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Proceedings Volume 2576, International Conference on Optical Fabrication and Testing; (1995) https://doi.org/10.1117/12.215616
Event: International Conferences on Optical Fabrication and Testing and Applications of Optical Holography, 1995, Tokyo, Japan
Abstract
Ductile mode grinding (DMG) process, which can provide geometric accuracy of 0. 1 tm without cracks on the surface, is highly expected as a next stage machining process of brittle materials. DMG can be achieved when grain depth of cut in uncut chipthickness is controlled to under the ductile-brittle transition value, dc, dc 0. 1 pm for Si wafer'. It is required to develop both ultraprecision grinding machine (2) and truing technology of diamond wheels. In particular ,for realizing ductile mode grinding of brittle materials, the absolute requirement is that the grain depth of cut dg of all active cutting edges has to be smaller than the ductile-brittle transition value, do.. An extruded cutting edge (ECE) from the envelope of adjacent cutting edges causes a serious problem of scratch generation. The present paper deals with observation and analysis of grinding scratch generation around central part of 5, wafers ground with diamond wheels on rotary work-spindle machines.
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Michimasa Daito, Michimasa Daito, Akira Kanai, Akira Kanai, Masakazu Miyashita, Masakazu Miyashita, } "Observation and analysis of grinding scratch generation around the central part of a component", Proc. SPIE 2576, International Conference on Optical Fabrication and Testing, (2 August 1995); doi: 10.1117/12.215616; https://doi.org/10.1117/12.215616
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