19 January 1996 Object-oriented visual inspection tool for ultrafine-pitch SMD components
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Abstract
Surface mount devices (SMDs), a dominant component type on printed circuit boards these days, are becoming smaller and growing more leads. This is in response to the shrinking of electronic components that is necessary for smaller electronic tools. The trend toward ever smaller components makes component leads more fragile and makes packages harder to handle. As a result, lead inspection has become more crucial than ever before. This paper includes a description of the object-oriented visual inspection tool (OOVIT) development for fine-pitch SMD components and its final structure.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ismail Fidan, Ismail Fidan, Larry Ruff, Larry Ruff, Stephen Derby, Stephen Derby, } "Object-oriented visual inspection tool for ultrafine-pitch SMD components", Proc. SPIE 2599, Three-Dimensional and Unconventional Imaging for Industrial Inspection and Metrology, (19 January 1996); doi: 10.1117/12.230391; https://doi.org/10.1117/12.230391
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