15 January 1996 Silicon microbench heater elements for packaging optoelectronic devices
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Proceedings Volume 2610, Laser Diode Chip and Packaging Technology; (1996) https://doi.org/10.1117/12.230085
Event: Photonics East '95, 1995, Philadelphia, PA, United States
Abstract
Examples are presented of the application of Lawrence Livermore National Laboratory's expertise in photonics packaging. Several examples of packaged devices are described. Particular attention is given to silicon microbenches incorporating heaters and their use in semiconductor optical amplifier fiber pigtailing and packaging.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Richard L. Combs, Richard L. Combs, Michael D. Pocha, Michael D. Pocha, Oliver Ted Strand, Oliver Ted Strand, } "Silicon microbench heater elements for packaging optoelectronic devices", Proc. SPIE 2610, Laser Diode Chip and Packaging Technology, (15 January 1996); doi: 10.1117/12.230085; https://doi.org/10.1117/12.230085
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