27 December 1995 Flip-chip optical fiber attachment to a monolithic optical receiver chip
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We report on manufacturable, low cost scheme for precision packaging a monolithically integrated GaAs optical receiver. Silicon V-groove and flip-chip bonding technologies are used to reliably achieve the required alignment accuracy. A silicon fiber carrier, which houses the fiber in a V-groove, is flip-chip bonded on to the receiver chip. The light from the cleaved end of the fiber is reflected off the V-groove end on to the planar photodetector, with an optical coupling efficiency of 85%. The entire fiber attach process uses standard semiconductor fabrication and processing techniques, making it attractive for low cost manufacturing.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Vijayanand Vusirikala, Vijayanand Vusirikala, Peter J.S. Heim, Peter J.S. Heim, Mario Dagenais, Mario Dagenais, C. Philip McClay, C. Philip McClay, } "Flip-chip optical fiber attachment to a monolithic optical receiver chip", Proc. SPIE 2613, Emerging Components and Technologies for All-Optical Networks, (27 December 1995); doi: 10.1117/12.228877; https://doi.org/10.1117/12.228877

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