Printability of laser mask repairs at deep UV

James A. Reynolds; Franklin M. Schellenberg

doi:10.1117/12.228165

8 December 1995 Printability of laser mask repairs at deep UV

James A. Reynolds, Franklin M. Schellenberg

Proceedings Volume 2621, 15th Annual BACUS Symposium on Photomask Technology and Management; (1995) https://doi.org/10.1117/12.228165
Event: 15th Annual BACUS Symposium on Photomask Technology and Management '95, 1995, Santa Clara, CA, United States

Abstract

Over 50% of today's 5X reticles require some sort of repair to meet the zero defect criteria. A successful repair must remove materials so the aerial image of the defective site is identical to that of a nondefective site within the tolerance required by the printing process. Shorter printing wavelengths increase sensitivity to surface roughness and deposited films. In this study, three different laser repair techniques were used to remove selected defects from a standard KLA defect printability reticle and the reticle was printed onto wafers at 248 nm. An atomic force microscope (AFM), aerial image measurement system (AIMS) and scanning electron microscope (SEM) were used to evaluate the reticle and wafer sites.

Citation Download Citation

James A. Reynolds and Franklin M. Schellenberg "Printability of laser mask repairs at deep UV", Proc. SPIE 2621, 15th Annual BACUS Symposium on Photomask Technology and Management, (8 December 1995); https://doi.org/10.1117/12.228165

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