22 September 1995 Advanced FIB applications for product analysis
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Focused Ion Beam (FIB) systems have become a workhorse of the modem semiconductor Product Analysis Lab. They have proved invaluable in applications like specific area cross-sectioning for defect identification and process control, for materials analysis sample preparation, for e-beam and mechanical probing preparation and for design debug and fix prototyping. New generation FIB systems, with increased beam current and control have enabled new applications of the tool. This paper aims to discuss these new applications but the data is presented as it was gathered, as a series of case studies, where a particular problem encountered was overcome by innovative use of the FIB.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andrew Birnie, Andrew Birnie, Andrew Beaumont, Andrew Beaumont, Chris Dodd, Chris Dodd, Grant McNeil, Grant McNeil, } "Advanced FIB applications for product analysis", Proc. SPIE 2635, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis, (22 September 1995); doi: 10.1117/12.221448; https://doi.org/10.1117/12.221448

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