Manufacturing challenges for sub-half micron technologies

Fu-Tai Liou

doi:10.1117/12.221435

22 September 1995 Manufacturing challenges for sub-half-micron technologies

Fu-Tai Liou

Proceedings Volume 2635, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis; (1995) https://doi.org/10.1117/12.221435
Event: Microelectronic Manufacturing '95, 1995, Austin, TX, United States

Abstract

The high demand for advanced, high speed and lower power MPU/ASIC and memory products has boosted the volume and revenue growth of the whole semiconductor industry during the past several years. The evolution of semiconductor technology is also gaining a lot of momentum due to the requirement/competition of the device performance advancement, power supply scaling and the breakthrough of key process equipment and technology. It used to be that memory products drove the new generations of technology. Recently, it is seen that MPU and logic products are driving the performance and density even faster than memories. All products are taking advantage of the technology and equipment advancements to shrink the device for cost reduction and performance enhancement. These new products are being introduced with high speed to the market and to volume production. This fast growing and fast changing environment will provide many challenges to the business management. Some key issues like business environment changes, technology scaling, mass production and management leadership requirements will be discussed in detail.

Citation Download Citation

Fu-Tai Liou "Manufacturing challenges for sub-half-micron technologies", Proc. SPIE 2635, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis, (22 September 1995); https://doi.org/10.1117/12.221435

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