High throughput and low cost production with 100% yield is strictly demanded for ULSI manufacturing, where a decrease of minimum feature size of device and an increase of wafer diameter are continuously enhanced for future. It will be available based on an introduction of simplified processing due to simplified device structure by introducing new concept device and new materials to Si technology. Simplification of manufacturing process becomes available based on fully understanding of process mechanisms in a scientific manner, resulting in a dramatic reduction of process steps.
"Future manufacturing technology in the year 2000", Proc. SPIE 2636, Microelectronic Device and Multilevel Interconnection Technology, (15 September 1995); doi: 10.1117/12.221121; https://doi.org/10.1117/12.221121