19 September 1995 Contamination control for ultrapure chemicals from microelectronics fab
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In this paper it is described the techniques and results for contamination control of process chemicals. Two distinct analytical problems are studied: The first concerns the analysis methods of dissolved and insoluble impurities, with the second concerns the analysis of particulate matter separated from the solutions by ultrafiltration techniques to 0.2 microns. The results suggest that considerable quantities of insoluble metallic impurities can be present in semiconductor grade chemicals and that they can be removed by ultrafiltration techniques. In our study we are concerned with the met processing stage including the quality of the chemicals used for developing, reusing, etching, and cleaning procedures in photolithographic processing. In our experience the pure chemical contain considerable quantities of particulate matter. In MOS integrated circuit technologies where the electrical functioning of the devices is surface dependence, the presence of small quantities of specific impurities is even more critical. In order to determinate the quantitive levels of dissolved and particulate impurities present in semiconductor processing chemicals three methods were chosen for their sensitivity and simplicity: (1) Activation analysis, (2) Flamless atomic absorption, and (3) X-ray fluorescence.
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Dumitru Gh. Ulieru, Dumitru Gh. Ulieru, "Contamination control for ultrapure chemicals from microelectronics fab", Proc. SPIE 2637, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing, (19 September 1995); doi: 10.1117/12.221319; https://doi.org/10.1117/12.221319

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