Examination of glass-silicon and glass-glass bonding techniques for microfluidic systems

Norman F. Raley; J. Courtney Davidson; Joseph W. Balch

doi:10.1117/12.221298

19 September 1995 Examination of glass-silicon and glass-glass bonding techniques for microfluidic systems

Norman F. Raley, J. Courtney Davidson, Joseph W. Balch

Proceedings Volume 2639, Micromachining and Microfabrication Process Technology; (1995) https://doi.org/10.1117/12.221298
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States

Abstract

We report here on the results of experiments concerning particular bonding processes potentially useful for ultimate miniaturization of microfluidic systems. Direct anodic bonding of continuous thin pyrex glass of 250 micrometers thickness to silicon substrates gives multiple, large voids in the glass. Etchback of thick glass of 1200 micrometers thickness bonded to silicon substrates gives thin continuous glass layers of 189 micrometers thickness without voids over areas of 5 cm X 12 cm. Glass was also successfully bonded to glass by thermal bonding at 800 degrees C over a 5 cm X 7 cm area. Anticipated applications include microfabricated DNA sequencing, flow injection analysis, and liquid and gas chromatography microinstruments.

Citation Download Citation

Norman F. Raley, J. Courtney Davidson, and Joseph W. Balch "Examination of glass-silicon and glass-glass bonding techniques for microfluidic systems", Proc. SPIE 2639, Micromachining and Microfabrication Process Technology, (19 September 1995); https://doi.org/10.1117/12.221298

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