15 September 1995 3DμV: a MEMS 3D visualization package
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Proceedings Volume 2642, Micromachined Devices and Components; (1995); doi: 10.1117/12.221181
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States
Abstract
A 3D color graphics visualization package has been developed for MEMS design. The package takes input in CIF format and translates the 2D layout information into a 3D rendering of the design. The user can pan, zoom, and rotate the entire design, or select any individual object and translate, rotate, or scale it. 3Dmicrometers V allows interactive assembly and 3D modeling of hinged, out-of-plane structures. It is particularly useful when interacting parts need to be modeled. A kinematic modeler (collision detection and simulation) has been incorporated into the package. The user can easily manipulate parts and assembly structures, determine clearances, and check for design errors and unexpected inconsistences. Processes supported currently are two-poly/two-sacrificial surface processes (such as the process offered by MCNC in the US), and high aspect ratio processes such as LIGA. Depending on process complexity, new processes can be added to the system with very little effort. As a part of the UCLA MEMS synthesis and analysis CAD toolset, 3Dmicrometers V is public domain, and is available by anonynous FTP from synergy.icsl.ucla.edu. 3Dmicrometers V weas developed on a Sun Sparcstation and written in C with X11R5 Xt and PHIGS-SI graphics library.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nanping R. Lo, Kristofer S. J. Pister, "3DμV: a MEMS 3D visualization package", Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); doi: 10.1117/12.221181; https://doi.org/10.1117/12.221181
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KEYWORDS
Computer aided design

Microelectromechanical systems

Visualization

3D modeling

Sensors

Process modeling

Scanning electron microscopy

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