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15 September 1995 Monolithic multiple axis accelerometer design in standard CMOS
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Proceedings Volume 2642, Micromachined Devices and Components; (1995) https://doi.org/10.1117/12.221155
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States
Abstract
Using a single maskless postprocessing step we have developed an accelerometer in a standard commercial CMOS process capable of a sensitive axis parallel or perpendicular to the die surface. Out postprocess is realized using xenon difluoride (XeF2) as a bulk etchant. The combination of this etchant and the standard CMOS process allows realization of cantilevers with piezoresistive sensors in all spacial coordinates from a widely-accessible source and at a minimal cost. Fabrication of accelerometers for all three axes and associated electronics on a single piece of silicon reduces the cost of 3D acceleration detection while increasing sensor reliability.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Brett Warneke, Eric G. Hoffman, and Kristofer S. J. Pister "Monolithic multiple axis accelerometer design in standard CMOS", Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); https://doi.org/10.1117/12.221155
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