15 September 1995 Multiaxis microcoil sensors in standard CMOS
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Proceedings Volume 2642, Micromachined Devices and Components; (1995) https://doi.org/10.1117/12.221168
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States
Abstract
The subsystems of an integrated MEMS 3D magnetic sensor are described and created using a standard CMOS fabrication process. For the completed sensor, after fabrication, the chip is micromachined and the sensor is assembled. The sensing is done by a two layer, aluminum coil whose equivalent area is specific to being sent off chip. The sensitivity and resolution of the transducer is found and shown to be a function of frequency. The frequency response is shown to be linear. Both higher sensitivity and finer resolution can be achieved by increasing the equivalent area of the micro-coil or by using a higher input frequency. The next phase is to fabricate the complete three axis system with two perpendicular coils rotated off the substrate and one remaining on the substrate.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Beverley Eyre, Beverley Eyre, Kristofer S. J. Pister, Kristofer S. J. Pister, Walter Gekelman, Walter Gekelman, } "Multiaxis microcoil sensors in standard CMOS", Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); doi: 10.1117/12.221168; https://doi.org/10.1117/12.221168
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