15 September 1995 Multiaxis microcoil sensors in standard CMOS
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Proceedings Volume 2642, Micromachined Devices and Components; (1995) https://doi.org/10.1117/12.221168
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States
Abstract
The subsystems of an integrated MEMS 3D magnetic sensor are described and created using a standard CMOS fabrication process. For the completed sensor, after fabrication, the chip is micromachined and the sensor is assembled. The sensing is done by a two layer, aluminum coil whose equivalent area is specific to being sent off chip. The sensitivity and resolution of the transducer is found and shown to be a function of frequency. The frequency response is shown to be linear. Both higher sensitivity and finer resolution can be achieved by increasing the equivalent area of the micro-coil or by using a higher input frequency. The next phase is to fabricate the complete three axis system with two perpendicular coils rotated off the substrate and one remaining on the substrate.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Beverley Eyre, Beverley Eyre, Kristofer S. J. Pister, Kristofer S. J. Pister, Walter Gekelman, Walter Gekelman, "Multiaxis microcoil sensors in standard CMOS", Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); doi: 10.1117/12.221168; https://doi.org/10.1117/12.221168
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