15 September 1995 Packaging of MEMS devices
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Proceedings Volume 2642, Micromachined Devices and Components; (1995); doi: 10.1117/12.221179
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States
Abstract
This paper examines issues in the packaging of silicon-micromachined devices. Standard microelectonics packaging seeks to physically isolate the integrated circuits from harmful elements in the environment, to provide mechanical strength for the die, to facilitate thermal dissipation, and to sustain electrical communication with outside circuits. However, due to the many novel applications of MEMS devices, new sets of packaging requirements need to be met and further research on packaging technology to meet non-traditional requirements are needed.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Albert K. Hu, Evan D. Green, "Packaging of MEMS devices", Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); doi: 10.1117/12.221179; https://doi.org/10.1117/12.221179
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KEYWORDS
Packaging

Microelectromechanical systems

Sensors

Reliability

Silicon

Semiconducting wafers

Integrated circuits

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