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15 September 1995 Rapid prototyping of a micro pump with laser micromachining
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Proceedings Volume 2642, Micromachined Devices and Components; (1995)
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States
A microelectrohydrodynamic (EHD) injection pump has been developed using laser micromachining technoogy. Two desings have been fabricated, tested, and evaluated. The first design has two silicon pieces with KOH-etched wells which are stacked on the tpo of each other. The wells are etched on one side of the wafer and gold is deposited on the other side to serve as the pump electrodes. A Nd:YAG laser is used to drill an array of circular holes in the well region of both silicon parts. This creates a grid distribution with a square pattern. Next the well regions of the silicon parts are aligned, and the parts are bonded together using a Staystik thermoplastic. The pump unit is then mounted into a ceramic package with a large hole drilled in the bottom of the package to permit fluid flow. Aluminum ribbon wire bonds are used to connect the pump electrodes to the package leads. Isolation of metallization and wires is achieved by filling the package well and coating the wires with polyimide. When a voltage is applied at the electrodes, ions are injected into the working fluid, such as an organic solvent, thus inducing flow. The second design has the silicon parts oriented 'back-to-back' and bonded together with Stayform. A 'back-to-back' design will decrease the grid distance so that a smaller voltage is required for pumping. Preliminary results have demonstrated that this micropump can achieve a pressure head of about 287 Pa with an applied voltage of 120 Volt.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. Channy Wong, Dahwey Chu, Sally L. Liu, Melanie R. Tuck, Zahid Mahmud, and Vincent A. Amatucci "Rapid prototyping of a micro pump with laser micromachining", Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995);

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