11 March 1996 Defect analysis with black beam interferometry
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The method of Black BeamR Interferometry, which was developed for inspection of glass substrates in LCD manufacturing, is extended in order to achieve a detailed description and classification of defects and other features on the surface under inspection. With a properly arranged detection system, not only a high defect detectability is provided, but also the ability to discriminate between the up or down defects (bumps or pits) in addition to the possibility of measuring the defect geometry (for large defects or structures) and the equivalent defect volume. The method is described and the results of simulations and experiments are presented.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gregory Toker, Gregory Toker, Andrei Brunfeld, Andrei Brunfeld, "Defect analysis with black beam interferometry", Proc. SPIE 2651, Liquid Crystal Materials, Devices, and Applications IV, (11 March 1996); doi: 10.1117/12.235346; https://doi.org/10.1117/12.235346

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