Optoelectronic interconnection can provide a practical solution for the ever increasing communication bottleneck problems among a multitude of information processing units. As research activities progress in the field of serial or parallel board-to-board and module-to- module interconnection, some of the research focus has shifted to smaller physical dimensions, like intra-module interconnection, which combines optoelectronic interconnection, multichip module packaging, and microelectromechanical system technologies at the module level. This paper describes novel integrated optical input/output couplers on multichip modules using micro-machined silicon mirrors to be used for optoelectronic multichip modules. The proposed microstructure integrates optical waveguide networks, multilayer electrical transmission line networks, micro-machined silicon mirrors, and flip-chip bonded photonic devices into a single structure. Using both sides of the silicon wafers, multiple metal layers and optical waveguide layers can be successfully fabricated for all metals or optical waveguides. The proposed input/output coupling method utilizes an innovative combination of through-holes across OE- MCM and micro-machined silicon mirrors integrated together into a single package.