29 March 1996 MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging
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Abstract
Both multichip modules (MCMs) and optical interconnects are expected to play a pivotal role in the development of high performance electronic systems. Only by packaging optoelectronic components within the multichip modules can the advantages of both technologies be realized. We have demonstrated the incorporation of optoelectronic components into two different MCM technologies. In the first, we have used existing equipment and proven polymer materials to implement optoelectronic interfaces in a high density 'chip-first' technology. In the second, we have demonstrated optoelectronic packaging in 'chip-and-wire' packaging schemes. In both cases, the optical characteristics are compatible with commercial vertical cavity surface emitting lasers and optoelectronic receivers, allowing the implementation of practical MCM-to-MCM interconnects.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Julian P. G. Bristow, Julian P. G. Bristow, Yue Liu, Yue Liu, Terry Marta, Terry Marta, Klein Johnson, Klein Johnson, Brian R. Hanzal, Brian R. Hanzal, Andrzej Peczalski, Andrzej Peczalski, Sommy Bounnak, Sommy Bounnak, Yung-Sheng Liu, Yung-Sheng Liu, Herbert S. Cole, Herbert S. Cole, "MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging", Proc. SPIE 2691, Optoelectronic Packaging, (29 March 1996); doi: 10.1117/12.236922; https://doi.org/10.1117/12.236922
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