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29 March 1996 Modeling VCSEL characteristics using device and package models
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Abstract
An integrated tool has been developed to predict how vertical cavity surface emitting laser (VCSEL) light output power is affected by packaging components. The set that has been developed includes modeling tools for devices and packages. The integrated tool can be useful for choosing an optimum specific package design for a VCSEL structure and to predict its characteristics in different packages under a variety of operating conditions. In this paper the integrated tool has been applied to study how VCSEL light output power is affected by different assembly technologies and packaging materials.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nina D. Morozova and Yung-Cheng Lee "Modeling VCSEL characteristics using device and package models", Proc. SPIE 2691, Optoelectronic Packaging, (29 March 1996); https://doi.org/10.1117/12.236920
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