29 March 1996 rf optoelectronic transmitter and receiver arrays on silicon wafer boards
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Silicon waferboard technology based on etched and deposited passive-alignment features has been applied to the fabrication of optoelectronic transmitter and receiver arrays for rf applications. Using silicon waferboards, we have aligned both 1 by 4 buried-heterostructure laser arrays and 1 by 4 PIN photodetector arrays to optical fiber ribbons. Besides serving as mechanical carriers and alignment guides, the silicon wafers can also be used as rf or microwave substrates. We introduce rf-optoelectronic receiver arrays based on such enhanced silicon waferboards.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Daniel Yap, Willie W. Ng, Deborah M. Bohmeyer, Hui Pin Hsu, Huan-Wun Yen, Marvin J. Tabasky, Andrew J. Negri, Joseph Mehr, Craig A. Armiento, Paul O. Haugsjaa, "rf optoelectronic transmitter and receiver arrays on silicon wafer boards", Proc. SPIE 2691, Optoelectronic Packaging, (29 March 1996); doi: 10.1117/12.236912; https://doi.org/10.1117/12.236912

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