20 March 1996 Compact and extensible optical interconnect module for a free-space optical backplane
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Abstract
The design of a set of optics for a free-space digital optical backplane is presented. The optical system is designed to interconnect smart pixel chips using reflective modulators flip-chip bonded to CMOS circuitry. It consists of arrays of diffractive minilenses forming a 4f system around successive polarizing beamsplitter cubes. The minilenses between the optical power supply and the modulators are transmissive and on-axis, while those for the detectors are reflective and off-axis and emulate microprisms for beamsteering. The minilenses are augmented by microlens arrays for final focusing onto the clustered modulator windows. The optical module described has low loss, is highly compact and using f/4 diffractive optics supports 515 smart pixels/cm2 for a chip size of 1 cm2, giving a connection density of 2060/cm2. Given flexibility in chip layout, this can be raised to a connection density of 4500/cm2. Detailed analysis shows that the system meets performance targets set by considering present electronic backplanes, while conforming to the fabrication limitations of diffractive optics.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dominic J. Goodwill, Harvard Scott Hinton, "Compact and extensible optical interconnect module for a free-space optical backplane", Proc. SPIE 2692, Optical Interconnects in Broadband Switching Architectures, (20 March 1996); doi: 10.1117/12.235846; https://doi.org/10.1117/12.235846
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