8 April 1996 High-speed micromachining with UV-copper vapor lasers
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Abstract
Ablation rate characteristics (etch rates) are presented for micro-machining of polyimide (kapton) and PETG using a frequency doubled Copper Vapor Laser (uv-CVL) at 255 nm and a frequency quadrupled Nd:YLF (4*Nd:YLF) laser at 261 nm. A comparison is made of the etch rates obtained by continuous ablation at 4.25 kHz with the uv-CVL with rates obtained for bursts of pulses with 2 second intervals between bursts. These results suggest that the observed decrease in ablation depth per pulse after a number of pulses for fluences above 0.6 J/cm2 is due to attenuation of succeeding laser pulses by the plume of previously-ejected material. Preliminary results of the effect of sample temperature on ablation rates are also presented.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Elizabeth K. Illy, Elizabeth K. Illy, Alison C. J. Glover, Alison C. J. Glover, Michael J. Withford, Michael J. Withford, James A. Piper, James A. Piper, } "High-speed micromachining with UV-copper vapor lasers", Proc. SPIE 2703, Lasers as Tools for Manufacturing of Durable Goods and Microelectronics, (8 April 1996); doi: 10.1117/12.237754; https://doi.org/10.1117/12.237754
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