UV-laser investigation of dielectric thin films

K. Ettrich; Holger Blaschke; Eberhard Welsch; Peter Thomsen-Schmidt; Dieter Schaefer

doi:10.1117/12.240407

27 May 1996 UV-laser investigation of dielectric thin films

K. Ettrich, Holger Blaschke, Eberhard Welsch, Peter Thomsen-Schmidt, Dieter Schaefer

Proceedings Volume 2714, 27th Annual Boulder Damage Symposium: Laser-Induced Damage in Optical Materials: 1995; (1996) https://doi.org/10.1117/12.240407
Event: Laser-Induced Damage in Optical Materials: 1995, 1995, Boulder, CO, United States

Abstract

Utilizing thermal Mirage technique, UV laser damage resistivity studies on LaF₃/MgF₂, Al₂O₃/SiO₂, and HfO₂/SiO₂ multilayer stacks have been performed at (lambda) equals 248 nm, (tau) equals 20 ns. Investigating these stacks by changing the number of (HL) pairs and the substrate material, optical and thermal coating properties were shown to be responsible for UV single-shot laser damage. Similarly, the damage threshold of selected samples is to be influenced by the deposition technique. Furthermore, multishot damage measurements on LaF₃/MgF₂ high-reflecting multilayer coatings reveal the accumulation of laser energy in the predamage range.

Citation Download Citation

K. Ettrich, Holger Blaschke, Eberhard Welsch, Peter Thomsen-Schmidt, and Dieter Schaefer "UV-laser investigation of dielectric thin films", Proc. SPIE 2714, 27th Annual Boulder Damage Symposium: Laser-Induced Damage in Optical Materials: 1995, (27 May 1996); https://doi.org/10.1117/12.240407

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