30 May 1996 Microtelemetry techniques for implantable smart sensors
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Abstract
The advent of the emerging field of smart sensors suggests new applications for implantable microelectronic devices in neural prostheses. Optimal use of miniature and subminiature (thin- film) electronic sensors in implanted systems will depend upon the nature of the power and communication link to the sensor. Microtelemetry technology is under current development to meet this need. Microtelemetry techniques can be used to provide operating power and bi- directional communication for a microimplant through a common, wireless, magnetic link. Owing to the extremely unfavorable geometry, i.e. the size of the implant relative to the size of the extracorporeal transmitter, the design of such links is highly parametric. Magnetic circuit parameters must be closely matched to the implant's integrated-circuit power usage. In addition, the bandwidth of the communication channel must be adequate to meet the data collection requirements. This paper describes on-going R&D work for the design and fabrication of smart sensors based upon microtelemetry technology. Presently, sensor designs for two applications are in progress -- EMG and joint angle position.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Philip R. Troyk, Philip R. Troyk, M. A.K. Schwan, M. A.K. Schwan, G. A. DeMichele, G. A. DeMichele, Gerald E. Loeb, Gerald E. Loeb, Joe Schulman, Joe Schulman, P. Strojnik, P. Strojnik, } "Microtelemetry techniques for implantable smart sensors", Proc. SPIE 2718, Smart Structures and Materials 1996: Smart Sensing, Processing, and Instrumentation, (30 May 1996); doi: 10.1117/12.240887; https://doi.org/10.1117/12.240887
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