20 May 1996 Characterization study of flip chip integration for MEMS
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This paper will describe the characterization study conducted to determine the suitability of Flip Chip integration of electronics with MEMS. Successful demonstration of the operation of various MEMS devices in conjunction with Flip Chip is reported. Flip chip solder bumping of integrated circuits is routinely used for packaging purposes and has now been extended to the placement of electronics in close proximity to MEMS devices. The flip chip approach separates the fabrication of the MEMS and electronic devices, allowing both the IC's and MEMS to be fabricated of many different substrate materials, not just single crystal silicon. The close proximity of the electronics to the MEMS devices is very desirable to improve signal to noise performance, and provide higher levels of systems integration. This new approach provides batch fabrication capability as opposed to the serial hybrid approach, without having to fabricate the electronics and MEMS on the same chip. Results on the characterization study of attachment of surface and bulk micromachined structures to glass and silicon substrates is reported.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Vijayakumar R. Dhuler, Karen W. Markus, Allen Cowen, D. Roberson, M. Berry, S. Nangalia, "Characterization study of flip chip integration for MEMS", Proc. SPIE 2722, Smart Structures and Materials 1996: Smart Electronics and MEMS, (20 May 1996); doi: 10.1117/12.240442; https://doi.org/10.1117/12.240442


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