20 May 1996 Integration of MUMPS and electronics for system prototyping
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In order to create true Smart MEMS systems, the integration of electronics with the MEMS devices is essential. There are currently three methods of integration available: monolithic integration, flip chip attachment and hybrid assembly. The use of flip chip attachment for Smart MEMS has previously been described, and is now available as part of the ARPA- supported MEMS infrastructure programs MUMPs and TechNet. This paper will describe the electromechanical control system chip and the method of using it in conjunction with MUMPs to develop Smart MEMS prototypes.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Karen W. Markus, Karen W. Markus, Vijayakumar R. Dhuler, Vijayakumar R. Dhuler, Ramu Mahadevan, Ramu Mahadevan, Allen Cowen, Allen Cowen, A. Shishkoff, A. Shishkoff, } "Integration of MUMPS and electronics for system prototyping", Proc. SPIE 2722, Smart Structures and Materials 1996: Smart Electronics and MEMS, (20 May 1996); doi: 10.1117/12.240435; https://doi.org/10.1117/12.240435


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