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27 May 1996 Thick PMMA layer formation as an x-ray imaging medium for micromachining
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Conventional resist application techniques are based on spinning a resist layer onto a mechanically dominating substrate. As thicker imaging layers are required, the integrity of the resist/substrate system is influenced by the resist thickness. The traditional LIGA approach is to form a PMMA resist sheet on the substrate by casting using a press. This method causes high stresses in the resist and at the resist/substrate interface. Another method consists of gluing or bonding a PMMA sheet with subsequent machining to a desired thickness. The stresses can be high enough to cause the resist to crack and/or separate from the substrate. In this paper, alternative and improved techniques are presented. One of these is a modified multiple coating spin-on method, suitable for producing PMMA resist thickness of 60-80 micrometers . The other method is based on bonding a solid PMMA sheet of desired thickness using an appropriate solvent. These techniques produce uniform PMMA layers with thicknesses ranging from 5 micrometers to 1500 micrometers and above. A mechanical cleaving test was used to estimate the resist/substrate bond strength and characterize the bonding solvents. Issues such as radiation swelling and thickness losses associated with latent image formation in PMMA are addressed.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Olga Vladimirsky, Gina M. Calderon, Yuli Vladimirsky, and Harish M. Manohara "Thick PMMA layer formation as an x-ray imaging medium for micromachining", Proc. SPIE 2723, Electron-Beam, X-Ray, EUV, and Ion-Beam Submicrometer Lithographies for Manufacturing VI, (27 May 1996);

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