Method of comparing chemical contrast with resist contrast

Gregory M. Wallraff; Juliann Opitz; Gregory Breyta; Hiroshi Ito; Bruce M. Fuller

doi:10.1117/12.241814

14 June 1996 Method of comparing chemical contrast with resist contrast

Gregory M. Wallraff, Juliann Opitz, Gregory Breyta, Hiroshi Ito, Bruce M. Fuller

Proceedings Volume 2724, Advances in Resist Technology and Processing XIII; (1996) https://doi.org/10.1117/12.241814
Event: SPIE's 1996 International Symposium on Microlithography, 1996, Santa Clara, CA, United States

Abstract

This report describes a simple method for quantifying the extent of reaction occurring in positive tone chemically amplified photoresists. It involves comparing the amount of photoacid-induced deprotection (measured by FT-IR) to the resist thickness loss (e.g. the characteristic curve for resist contrast) measured as a function of incident dose. This method compares what we have termed the 'chemical contrast' to the resist contrast. It potentially provides a way to identify factors other than deprotection reactions (such as cross-linking, other chemical reactions or the dissolution inhibition/promotion for the PAG itself) which affect the dissolution properties of chemically amplified resists. This method can also be used to correlate lithographic performance with the actual chemistry occurring in the resist film. Results for a variety of different resist systems are described.

Citation Download Citation

Gregory M. Wallraff, Juliann Opitz, Gregory Breyta, Hiroshi Ito, and Bruce M. Fuller "Method of comparing chemical contrast with resist contrast", Proc. SPIE 2724, Advances in Resist Technology and Processing XIII, (14 June 1996); https://doi.org/10.1117/12.241814

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