Customizing proximity correction for process-specific objectives

Michael L. Rieger; John P. Stirniman

doi:10.1117/12.240930

7 June 1996 Customizing proximity correction for process-specific objectives

Michael L. Rieger, John P. Stirniman

Proceedings Volume 2726, Optical Microlithography IX; (1996) https://doi.org/10.1117/12.240930
Event: SPIE's 1996 International Symposium on Microlithography, 1996, Santa Clara, CA, United States

Abstract

Proximity correction compensates systematic distortions of fabricated integrated circuit structures by providing 'inverse' distorted feature shapes on the mask pattern. Nominally, the 'best' correction might be an inverse shape that minimizes residual deviation at every point in the fabricated feature. However, depending upon the application, the optimum correction may not be defined in such simple terms. In this paper we will discuss methods for optimizing proximity corrections for different fabrication ofjectives and constraints.

Citation Download Citation

Michael L. Rieger and John P. Stirniman "Customizing proximity correction for process-specific objectives", Proc. SPIE 2726, Optical Microlithography IX, (7 June 1996); https://doi.org/10.1117/12.240930

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