ISC has developed an unique form of bump bonding based on a plug and socket concept which allows high density reflow solder array interconnects. Solder bumps with diameters of 50 microns and heights of 15 microns are plugged into sockets of photo definable polyimide 75 microns in diameter and 10 microns high. The technique is used to flip chip bond infrared detector arrays to Z-technology modules without the need for complex aligner-bonder tooling. The same method has been used for die interconnection bonding to substrates and motherboards, module to module interconnect array bonding and die to module bonding. The inherent self-alignment which occurs during reflow of an array of solder bumps has been shown useful in obtaining precise, 1 micron range, alignment accuracy between electro-optical components, such as gallium arsenide light emitting diodes and polymer waveguides deposited on a silicon substrate. The same plug and socket technology is being extended for applications using compliant polymer bumps.