26 June 1996 Three-dimensional sensor readout electronics using conventional detector hybrid assemblies
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Pressures to increase resolution, achieve compact packages, and lower costs continue to drive focal plane readout circuits to highly complex designs with lowered yields in cutting edge processes. By designing a set of signal processing electronics into a 3D structure, cost and performance goals can be met while using higher yielding readouts and existing focal plane hybrids. The approach described in this paper allows existing designs from 480 X 4 through 480 X 640 to be used in compact sensor designs in a wide variety of applications. The demonstration of the approach uses an existing InSb photovoltaic hybrid array in a 120 X 160 configuration. Functions for non- uniformity correction, memory, and analog-to-digital conversion have been incorporated into a structure compatible with conventional dewar assemblies for military and commercial applications. The technology for these 3D focal planes is applicable to sensor functions for non- uniformity correction, analog-to-digital conversion, spatial and temporal filtering, fovea vision, event-driven multiplexing, data compression and coding, and pattern recognition.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
William B. Hornback, William B. Hornback, } "Three-dimensional sensor readout electronics using conventional detector hybrid assemblies", Proc. SPIE 2745, Infrared Readout Electronics III, (26 June 1996); doi: 10.1117/12.243539; https://doi.org/10.1117/12.243539


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