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17 June 1996 AEG PtSi modules: a summary
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AEG has successfully developed a family of PtSi detection modules to cover various applications. The development was performed in a cooperation with Daimler Benz Research and Technology F2M and Telefunken Microelectronic TEMIC EZIS. The modules are designed around 2 staring PtSi focal plane arrays (FPA) having 256 X 256 pixels or 640 X 486 pixels, respectively. Both arrays are identical in their basic features like 24 micrometers pitch, > 60% fillfactor, variable integration time, optional interlaced and non interlaced rolling frame readout, subframe capability and excellent thermal resolution with measured values for the NETD < 70 mK (300 K, 20 ms, F/1.4). The FPA's are integrated either in integrated dewar cooler assemblies with a 1/3 W split linear compressor for the 256 X 256 FPA or a 1 W split linear compressor for the 640 X 486 FPA, respectively, or designed for the use in seeker applications with a Joule Thomson cryocooler (640 X 486 FPA only). The modules are completed by different miniaturized types of electronics, providing all DC and clock supplies to drive the FPA's and providing the customer with either a buffered analog or a 14 Bit resolution digital interface. Digital signal processor (DSP) based image correction units were developed for testing the units. The DSP boards provide the ability for freely programmable real-time functions like 2 point correction or other data manipulations in camera applications. The modules and their key features are reviewed together with their performance data.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wolfgang A. Cabanski, R. Koch, Horst Maier, G. Pahler, C. Joachim Wendler, Johann Ziegler, Karl C. Hofmann, Kurt Eberhardt, Peter P. Deimel, U. Prechtel, and K. Kapser "AEG PtSi modules: a summary", Proc. SPIE 2746, Infrared Detectors and Focal Plane Arrays IV, (17 June 1996);

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