23 August 1996 Large-scale high-resolution 3D laser scanner for solder-paste inspection
Author Affiliations +
Abstract
An industrial 3D laser scanner is presented for measurement of solder paste screening quality in an automated PCB assembly line. The scanner provides telecentric illumination and imaging in a 305 mm (12') long scan line at a maximum rate of more than 1000 scans per second. Synchronized height measurement is performed using a double triangulation scheme at large angles and wide aperture. Pixel sizes range down to 18 micrometers , yielding more than 16,000 pixels in a scan line. Depth resolution is 10 micrometers over a 2.5 mm measuring range. Some practical details on scanner assembly will be discussed. Combined with accurate, fast processing and control electronics this 3D sensor enables 100% inspection at high production speeds.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jef L. Horijon, Jef L. Horijon, Fred C. M. Couweleers, Fred C. M. Couweleers, Willem D. van Amstel, Willem D. van Amstel, } "Large-scale high-resolution 3D laser scanner for solder-paste inspection", Proc. SPIE 2774, Design and Engineering of Optical Systems, (23 August 1996); doi: 10.1117/12.246699; https://doi.org/10.1117/12.246699
PROCEEDINGS
9 PAGES


SHARE
Back to Top