1 September 1996 Non-destructive contactless tool for semiconductor wafer inspection
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Proceedings Volume 2778, 17th Congress of the International Commission for Optics: Optics for Science and New Technology; 27782F (1996) https://doi.org/10.1117/12.2298969
Event: 17th Congress of the International Commission for Optics: Optics for Science and New Technology, 1996, Taejon, Korea, Republic of
Abstract
A method for semiconductors investigation and technological inspection are represented. It's optical non-destructive contactless and expressive tool. There are two general ways for the method applications. The first one is detection of inhomogeneities for free carrier distribution in bulk of semiconductor, which occur due to electrically active defect. The second one is direct visualization of recombination picture on surface of semiconductor wafer (in over words, it's lifetimes mapping).
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
O. V. Astafiev, O. V. Astafiev, } "Non-destructive contactless tool for semiconductor wafer inspection", Proc. SPIE 2778, 17th Congress of the International Commission for Optics: Optics for Science and New Technology, 27782F (1 September 1996); doi: 10.1117/12.2298969; https://doi.org/10.1117/12.2298969
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