Formation method of particles arrangement on substrate and its analysis

Mikihiko Kobayashi; Hiroshi Fudouzi; Mitsuru Egashira; Norio Shinya

doi:10.1117/12.237066

26 April 1996 Formation method of particles arrangement on substrate and its analysis

Mikihiko Kobayashi, Hiroshi Fudouzi, Mitsuru Egashira, Norio Shinya

Proceedings Volume 2779, 3rd International Conference on Intelligent Materials and 3rd European Conference on Smart Structures and Materials; (1996) https://doi.org/10.1117/12.237066
Event: 3rd International Conference on Intelligent Materials, 1996, Lyon, France

Abstract

We proposed a particles assembling method to create intelligent and multi-functional materials. The arrangement of particles on substrates was studied as one of the important techniques for this approach. The arranging process is as follows. Electrified patterns were drawn on dielectric calcium titanate (CaTiO₃) substrates with electron beam scanning. The substrates were dipped in a solvent where silica (SiO₂) particles of 5.1 micrometers (phi) were dispersed. The particles were attracted to the electrified patterns by the electrostatic force, and were arranged along the electrified patterns. In this paper, undrawn substrates were used to know how many particles adhered on the unelectrified part, and then, arranging experiments using drawn substrates were carried out under various conditions to confirm the above process. We also discussed on the basic aspects of the arrangement, such as attraction force, motion of particles in the solvent, etc.

Citation Download Citation

Mikihiko Kobayashi, Hiroshi Fudouzi, Mitsuru Egashira, and Norio Shinya "Formation method of particles arrangement on substrate and its analysis", Proc. SPIE 2779, 3rd International Conference on Intelligent Materials and 3rd European Conference on Smart Structures and Materials, (26 April 1996); https://doi.org/10.1117/12.237066

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