26 April 1996 Thermomechanical properties in CuAlNi shape memory alloys processed by powder metallurgy
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Proceedings Volume 2779, 3rd International Conference on Intelligent Materials and 3rd European Conference on Smart Structures and Materials; (1996); doi: 10.1117/12.237162
Event: 3rd International Conference on Intelligent Materials, 1996, Lyon, France
Abstract
Among the different kinds of Smart Materials one of the more promising materials are the Shape Memory Alloys (SMA) because of their ability to perform two different tasks: "sensing and actuating" [1 ,2]. The thermomechanical properties of SMA with view of their use as smart materials have been recently reviewed [2,3]. Nowadays, three kinds of applications (active shape control, active modal modification and active strain energy tuning) based specifically on shape memory alloys are being developed [4,5]. Besides, in order to fulfil the increasing demand of smart materials with a large range of working temperature, several systems of SMA with higher transformation temperatures (until 240°C) are being explored, such as Ni-Al, Cu-Ni-Al, Fe-Mn-Si-X, Ti-Ni-Pd (see [6] for a review). Among them, Cu-Al-Ni shape memory alloys are firm candidates for applications between 100°C and 240°C because of their low cost, relatively easy processing and good shape memory properties. Nevertheless, due to their high elastic anisotropy (A13) and large grain size, the Cu-Al-Ni alloys are brittle, and in general show poor mechanical properties that should be improved in order to fulfil the requirements for practical applications. This improvement is usually accomplished through the addition of grain refiners such as Zr, Ti, B [7] to obtain a grain size lesser than 1OOm in diameter.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. San Juan, R. B. Perez-Saez, V. Recarte, I. Saez-Ocariz, M. L. No, O. Ruano, "Thermomechanical properties in CuAlNi shape memory alloys processed by powder metallurgy", Proc. SPIE 2779, 3rd International Conference on Intelligent Materials and 3rd European Conference on Smart Structures and Materials, (26 April 1996); doi: 10.1117/12.237162; https://doi.org/10.1117/12.237162
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KEYWORDS
Shape memory alloys

Particles

Smart materials

Temperature metrology

Oxides

Photomicroscopy

Actuators

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