8 April 1996 Polyimide films prepared by electrophoretic deposition and their dielectric breakdown
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Proceedings Volume 2780, Metal/Nonmetal Microsystems: Physics, Technology, and Applications; (1996) https://doi.org/10.1117/12.238126
Event: Metal/Nonmetal Microsystems: Physics, Technology, and Applications, 1995, Polanica Zdroj, Poland
Abstract
Electrophoretic deposition from non aqueous emulsion is one of the useful methods for forming polymer thin films selectively on metal electrodes. It has a potential to be used for forming an interdigital electrode for multilayer capacitor or actuator. A heat resistant polymer, polyimide (PI), film was prepared by the electrophoretic deposition method. Conductivity and dielectric strength were measured, comparing with casting and conventional PI films.
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Shuhei Nakamura, Shuhei Nakamura, Kazuo Iida, Kazuo Iida, Goro Sawa, Goro Sawa, } "Polyimide films prepared by electrophoretic deposition and their dielectric breakdown", Proc. SPIE 2780, Metal/Nonmetal Microsystems: Physics, Technology, and Applications, (8 April 1996); doi: 10.1117/12.238126; https://doi.org/10.1117/12.238126
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