1 November 1996 Packaging of ferroelectric liquid crystal-on-silicon spatial light modulators
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Abstract
A self-pulling soldering technology has been demonstrated for assembling liquid crystal on silicon (LCOS) spatial light modulators (SLMs). One of the major challenges in manufacturing the LCOS modules is to reproducibly control the thickness of the gap between the very large scale integrated circuit (VLSI) chip and the cover glass. The liquid crystal material is sandwiched between the VLSI chop and the cover glass which is coated with a transparent conductor. Solder joints with different profiles and sizes have been designed to provide surface tension forces to control the gap accommodating the ferroelectric liquid crystal layer in the range of a micron level with sub- micron uniformity. The optimum solder joint design is defined as a joint that results in the maximum pulling force. This technology provides an automatic, batch assembly process for a LCOS SLM through one reflow process. Fluxless soldering technology is used to assemble the module. This approach avoids residues from chemical of flux and oxides, and eliminates potential contamination to the device. Two different LCOS SLM designs and the process optimization are described.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
W. Lin, Nina D. Morozova, TehHua Ju, Weidong Zhang, Yung-Cheng Lee, Douglas J. McKnight, Kristina M. Johnson, "Packaging of ferroelectric liquid crystal-on-silicon spatial light modulators", Proc. SPIE 2848, Materials, Devices, and Systems for Optoelectronic Processing, (1 November 1996); doi: 10.1117/12.256141; https://doi.org/10.1117/12.256141
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