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Abstract
Models are highlighted as the key, underpinning element of specification and characterization of silicon wafers in the semiconductor industry. The role of models in interconnecting specifications, metrology, and standards across the domains of processes, equipment, and materials is described. Examples of failing models and new model approaches are provided for lithographic flatness and particle detection.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Randal K. Goodall "Silicon wafer specifications and characterization capabilities: another perspective", Proc. SPIE 2862, Flatness, Roughness, and Discrete Defect Characterization for Computer Disks, Wafers, and Flat Panel Displays, (4 November 1996); https://doi.org/10.1117/12.256190
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