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Abstract
Even though automated particle inspection sensitivities exceed 0.100 micrometers , visual inspections continue to flourish in the silicon wafer manufacturing facilities. These inspections continue due to the inability of Scanning Surface Inspection Systems (SSIS) to detect and identify a variety of wafer defects. Single integrating collection schemes have not provided sufficient information to accomplish this task. To realize full automated wafer inspection, additional inspection data must be obtained by the inspection process. Visual inspection has made great use of the near specular collection. SSISs must make use of this region. The employment of near specular inspection will greatly enhance the detection capabilities of these tools. This information must then be processed in a way to allow defect identification and sorting.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kevin Welch "Utilization of near specular energy in the detection of surface defects", Proc. SPIE 2862, Flatness, Roughness, and Discrete Defect Characterization for Computer Disks, Wafers, and Flat Panel Displays, (4 November 1996); https://doi.org/10.1117/12.256196
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