Automated collection of yield and performance analysis data during UltraSPARC-I microprocessor production test

Matt Koeppen; John Moore

doi:10.1117/12.250840

12 September 1996 Automated collection of yield and performance analysis data during UltraSPARC-I microprocessor production test

Matt Koeppen, John Moore

Author Affiliations +

Proceedings Volume 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II; (1996) https://doi.org/10.1117/12.250840
Event: Microelectronic Manufacturing 1996, 1996, Austin, TX, United States

Abstract

The UltraSPARC-I microprocessor is tested at several stages in the manufacturing flow to screen out any chips which contain manufacturing defects and to sort chips by speed. Custom test hardware and software have been developed to perform production test of UltraSPARC-I in both wafer and packaged form. To speed up chip yield and performance improvement, we collect detailed yield and performance measurement data during test of every microprocessor manufactured. The data collected includes detailed pass or fail results of individual patterns, performance measurements of maximum operating frequency and Vcc, parametric measurements of transistor saturation currents and ring oscillator frequencies, and Idd measurements. The goal of our data collection is to provide, without the need for engineering retest, immediate diagnostic information on why each chip yielded and performed as it did, enabling yield and performance issues to be quickly identified and subsequently resolved.

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Matt Koeppen and John Moore "Automated collection of yield and performance analysis data during UltraSPARC-I microprocessor production test", Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); https://doi.org/10.1117/12.250840

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