12 September 1996 Automated collection of yield and performance analysis data during UltraSPARC-I microprocessor production test
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Abstract
The UltraSPARC-I microprocessor is tested at several stages in the manufacturing flow to screen out any chips which contain manufacturing defects and to sort chips by speed. Custom test hardware and software have been developed to perform production test of UltraSPARC-I in both wafer and packaged form. To speed up chip yield and performance improvement, we collect detailed yield and performance measurement data during test of every microprocessor manufactured. The data collected includes detailed pass or fail results of individual patterns, performance measurements of maximum operating frequency and Vcc, parametric measurements of transistor saturation currents and ring oscillator frequencies, and Idd measurements. The goal of our data collection is to provide, without the need for engineering retest, immediate diagnostic information on why each chip yielded and performed as it did, enabling yield and performance issues to be quickly identified and subsequently resolved.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Matt Koeppen, John Moore, "Automated collection of yield and performance analysis data during UltraSPARC-I microprocessor production test", Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); doi: 10.1117/12.250840; https://doi.org/10.1117/12.250840
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