12 September 1996 Correlation between particle defects and electrical faults determined with laser scattering systems and digital measurements on checkerboard test structures
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Abstract
To improve accuracy of defect densities, yield prediction and failure analysis, this paper compares data on defects and faults collected by electrical measurement methods and laser scattering systems. For that we choose the checkerboard test structure design to partition the whole chip area into a large number of subchips, each containing defect sensitive comb lines. A digital tester based measurement procedure enables the detection and separation of faults. Additional analysis procedures guarantee a layer- specific fault localization inside specific subchips. manufacturing of test chips at Thesys Gesellschaft fur Mikroelektronik was accompanied by laser scattering after selected processed layers. Finally wafer maps based on electrically detected faults and optically detected particle defects were analyzed to determine correlations between defects and faults.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christopher Hess, Larg H. Weiland, Guenter Lau, Rainer Hiller, "Correlation between particle defects and electrical faults determined with laser scattering systems and digital measurements on checkerboard test structures", Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); doi: 10.1117/12.250853; https://doi.org/10.1117/12.250853
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