12 September 1996 Role of RIE in microchip bond pad corrosion
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Abstract
The discoloration of microchip bond pads due to the corrosive effects of the chemistries they are exposed to, poses a special problem for subsequent wire bonding operations. Such corrosion constitutes not only a cosmetic defect, but also interferes with the adhesion of the gold ball bonds to the bonding pads and compromises electrical connections to the device. These defects pose a serious reliability problem, and precautions must be taken in the manufacture of microelectronic devices to ensure that bond pad corrosion does not occur. This paper describes the phenomenon of bond pad staining/corrosion as well as the factors which influence its occurrence. A series of experiments were conducted to isolate and understand the corrosion mechanism, and the results of these experiments are presented. Finally, two different process modifications are presented which eliminate the occurrence of bond pad corrosion: a double sintering process, and the elimination of rf sputter etch prior to TiN ARC deposition on top layer metal.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rickey Brownson, Kevin Butler, Sally Cadena, Mark Detar, Ivan Johnson, Lonnie McCoulloch, Jim McCoulloch, Brajendra Mishra, Jerry T. Healey, Karen Honcik, Tony T. Phan, Todd Sterif, H. Stevens, Anita Tovar, "Role of RIE in microchip bond pad corrosion", Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); doi: 10.1117/12.250819; https://doi.org/10.1117/12.250819
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