12 September 1996 Time reduction of MCM-D prototype realization by process control and modeling
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The evolution of advanced packaging techniques like multi chip modules makes the realization of prototypes necessary. This can be a long and costly operation. Therefore we developed methods permitting time gains to be made in two of the steps of this operation. To avoid the use of physical masks we have experimented a laser beam set for direct writing of metal and insulating layers in microcircuits. To shorten preliminary tests, we propose a theoretical model of the interaction between the laser beam and the photoresist. It permits us to predict the line widths etched in the photoresist and thus avoids the need of long calibration processes. Electrical test lines of various widths have been used as a validation tool. The precision obtained is better than 5%. Polyimides (PI) meet most of the requirements for dielectric materials. As the curing process is crucial for the properties of the final PI film, thermal treatment was the subject of optimization leading however to process time up to more than 4 hours. We developed an interferometric control system in combination with a hot plate in order to provide an automated and optimized curing process. Total curing time is reduced to 1- 2 hours. Characterization and FTIR measurements were done for conventional and interferometrically controlled curing samples before and after aging in wet atmosphere: controlled samples are more crystalline, show comparable electrical and reliability properties, and seem less stressed.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Helene Fremont, Helene Fremont, C. Ahrens, C. Ahrens, E. Saint Christophe, E. Saint Christophe, B. Enoeckl, B. Enoeckl, M. Fathi, M. Fathi, G. N'kaoua, G. N'kaoua, C. Pellet, C. Pellet, Ruediger Ferretti, Ruediger Ferretti, Yves Danto, Yves Danto, } "Time reduction of MCM-D prototype realization by process control and modeling", Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); doi: 10.1117/12.250822; https://doi.org/10.1117/12.250822

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