12 September 1996 UltraSPARC-I microprocessor yield and performance analysis
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Rapidly changing demands in the microprocessor industry require that new products be quickly brought to volume production on the fastest fabrication process available. Two key metrics of success for manufacturing start-up of a microprocessor are manufacturing yield and product performance. We have developed a comprehensive data collection and analysis system to speed identification, measurement, diagnosis and resolution of yield and performance bottlenecks and therefore accelerate yield and performance improvement of the UltraSPARC-I microprocessor. Our system is based on automated collection of wafer processing and electrical parametric data plus detailed defect map, test and performance data collected for every microprocessor manufactured. This system and its application to yield and performance improvement are presented in this paper.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Derek C. Wrobbel, Derek C. Wrobbel, Kevin L. Walker, Kevin L. Walker, } "UltraSPARC-I microprocessor yield and performance analysis", Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); doi: 10.1117/12.250841; https://doi.org/10.1117/12.250841

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